Bakelite® Synthetics Resins for Electronic Applications

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Bakelite^® Resins for Electronic Applications

PRINTING PLATES / SEMICONDUCTOR PHOTORESIST / ELECTRICAL LAMINATES

Electronic applications require reliability, purity and precision. Bakelite® and Durite™ phenolic resins are used to produce high-quality electrical and electronic components that meet these stringent requirements while making manufacturing easier.

Printing Plates

Bakelite® cresol novolac resins offer advantages for printing plate production. Benefits of ultra-high purity Bakelite cresol novolacs include:

Precise viscosity control
Consistent bulk dissolution rates
Low free monomer

Applications for Bakelite® cresol novolacs include:

Offset printing
Digital printing
Computer To Plate (CTP)

Semiconductor Photoresist

Bakelite® and Durite™ phenolic/cresylic resins are ideal for photoresist formulations used to manufacture components for the semiconductor industry as well as LED production. These resins are specifically designed for g-line, i-line and advanced i-line lithography.

Optimized monomer ratios and controlled processing enable Bakelite to produce resins featuring a range of molecular weights and dissolution rates. Benefits of our resins include:

Uniform batches – no drum-to-drum variation
Low trace metals
Improved resolution
Improved heat resistance
Excellent substrate adhesion and CD control

Electrical laminates

Heat and moisture resistance are crucial for printed circuit boards (PCBs). Bakelite® and Durite™ high purity resins are used for chip encapsulation, as underfill adhesives, and in the impregnation of copper clad laminates (CCL) for PCBs. These resins provide: